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Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro, Kaisi Stencil Plant for iPhone 11 Series Option:Kaisi Stencil Plant for iPhone 11 Series bottom diameter 40mm

SKU: 25643587914

4.9
USD18.00 USD45.00

Pay in 4 interest-free payments of $4.50 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Jul 26 - Jul 31

Description

bottom diameter 40mm

Battery capacity: 370mah

Loading Container 20GP: 397 cartons * 40 pcs = 15880 pcs

40HQ: 1958 cartons * 160 pcs = 313280 pcs

Generally speaking

Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro, Kaisi Stencil Plant for iPhone 11 Series Option:Kaisi Stencil Plant for iPhone 11 Series bottom diameter 40mm1. Strong magnetic adsorption, simple operation 2. Fast and convenient soldering 3. High temperature resistance and easy heat dissipation 4. Pewter can be planted accurately at mesh position 5. No damage to the motherboard, accurate positionin Specification: Package Weight One Package Weight 0. 13kgs 0. 28lb One Package Size 15cm * 11cm * 3cm 5. 91inch * 4. 33inch * 1. 18inch Qty per Carton 80 Carton Weight 10. 60kgs 23. 37lb Carton Size 46cm * 32cm *

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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