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and associated interface panels
where a 450 FOUP and 450 MAC can be loaded and unloaded
The Analytical Procedures are listed in Table 1
SEMI E99-0317 (technical revision)
3 This Guide also applies to wafers or other geometrical shapes of any material type that show deflections more than 200% of the allowable bow tolerance when tested for bow using the conventional three-point mounting method
F05000 - SEMI F50 - Guide for Electric Utility Voltage Sag Performance for Semiconductor Factories Revision:SEMI F50-0200 (Reapproved 1021) - Current and associated interface panelsThis Guide provides a framework for semiconductor and flat panel display (FPD) manufacturers and their electric utility service providers to minimize the effect of voltage sag events on semiconductor processing. In particular, this Guide focuses on electric utility power quality performance goals that are complementary to voltage sag immunity levels for semiconductor processing equipment and facilities infrastructure equipment (see Figure 1).
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