E03900 - SEMI E39 - オブジェクトサービス･スタンダード：概念，挙動およびサービス StdPbc-0512 기판(substrate)의 위치

기판(substrate)의 위치

quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers

目的 － このスタンダードの目的は二つある：

This Guide defines standard terminologies for all the features of leadframes used in the production of semiconductor circuits

Ca in silicon powder may affect the purity level of produced trichlorosilane significantly

E03900 - SEMI E39 - オブジェクトサービス･スタンダード：概念，挙動およびサービス StdPbc-0512 기판(substrate)의 위치OSS. Subordinate Standards (included): SEMI E39. 1 0703 (Reapproved 1109) SECS II Protocol for Object Services Standard (OSS) Referenced SEMI Standards (purchase separately) SEMI E5 SEMI Equipment Communications Standard 2 Message Content (SECS II)